Methods for fabricating a compound semiconductor protection device for low voltage and high speed data lines

ABSTRACT

The invention relates to the protection of devices in a monolithic chip fabricated from an epitaxial wafer, such as a wafer for a Group III-V compound semiconductor or a wafer for a Group IV compound semiconductor. Devices fabricated from Group III-V compound semiconductors offer higher speed and better isolation than comparable devices from silicon semiconductors. Semiconductor devices can be permanently damaged when exposed to an undesired voltage transient such as electrostatic discharge (ESD). However, conventional techniques developed for silicon devices are not compatible with processing techniques for Group III-V compound semiconductors, such as gallium arsenide (GaAs). Embodiments of the invention advantageously include transient voltage protection circuits that are relatively efficiently and reliably manufactured to protect sensitive devices from undesired voltage transients. A protection circuit can be monolithically integrated with the protected circuit or can be packaged in a separate integrated circuit.

RELATED APPLICATION

[0001] This application is a divisional application of U.S. applicationSer. No. 10/096,995, entitled “COMPOUND SEMICONDUCTOR PROTECTION DEVICEFOR LOW VOLTAGE AND HIGH SPEED DATA LINES,” filed Mar. 12, 2002.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The invention generally relates to compound semiconductors. Inparticular, the invention relates to the protection of circuits fromundesired transient voltage spikes such as those from electrostaticdischarge (ESD).

[0004] 2. Description of the Related Art

[0005] An undesired voltage transient on a data line can damage anelectronic circuit. As technology progresses and device geometriescontinue to shrink, devices become ever more sensitive to voltagetransients. One example of a source of an undesired voltage transient iselectrostatic discharge (ESD).

[0006] Steering diodes and transient voltage suppressors have beenapplied to data lines in conventional circuits implemented in silicon.Where such steering diodes and/or transient voltage suppressors arefabricated from silicon on a monolithic chip, pnpn or npnp thyristorlatchup can occur, which can also damage the electronic circuit.Although incorporating discrete diodes and transient voltage suppressorson a monolithic chip is possible, such incorporation techniques caninvolve relatively expensive double-sided processing techniques andalignment methods, which are complex, expensive, and not standard toolsin the processing of silicon. Silicon has other disadvantages, such asrelatively low speed and relatively low isolation between devices. Therelatively low isolation between devices gives rise to relatively highleakage currents and can rapidly drain the batteries of battery-poweredcircuits.

[0007] Faster devices, such as heterojunction bipolar transistors (HBTs)and monolithic microwave integrated circuits (MMICs), using Group III-Vcompound semiconductors such as gallium arsenide (GaAs), indiumphosphide (InP), and the like, are preferred in certain relativelyhigh-speed applications, such as in relatively high-speed digitalcircuits and in relatively high-frequency wireless circuits. Suchcircuits are also sensitive to undesired voltage transients. Inconventional compound semiconductor circuits, a transient voltageprotection circuit is fabricated from discrete components and coupled toa monolithic compound semiconductor circuit through bond wires and dieattach. This results in a relatively low assembly yield and poorperformance. For example, the bond wires can exhibit relativelysignificant inductance, which can decrease protection from relativelyfast transients. In addition, relatively high parasitic capacitance fromthe wire-bonded discrete components renders such transient voltageprotection circuits relatively ill suited to high-speed circuits such asmicrowave circuits.

[0008] What is needed is a transient voltage protection circuit that ismonolithically integrated in a compound semiconductor circuit to protectthe sensitive devices from undesired voltage transients.

SUMMARY OF THE INVENTION

[0009] The invention relates to the protection of devices in amonolithic chip fabricated from an epitaxial wafer, such as a wafer of aGroup III-V compound semiconductor. A Group IV compound semiconductorcan also be used. Devices fabricated from Group III-V compoundsemiconductors offer higher speed and better isolation than comparabledevices from silicon semiconductors. Semiconductor devices can bepermanently damaged when exposed to an undesired voltage transient suchas electrostatic discharge (ESD). However, conventional techniquesdeveloped for silicon devices are not compatible with processingtechniques for devices that are fabricated from epitaxial wafers, suchas gallium arsenide (GaAs), which is a Group III-V compoundsemiconductor. Embodiments of the invention advantageously includetransient voltage protection circuits that are relatively efficientlyand reliably manufactured to protect sensitive devices from undesiredvoltage transients. Embodiments of the invention include circuits thatare monolithically integrated with the circuit to be protected and alsoinclude circuits that are fabricated and packaged in a separateintegrated circuit and are coupled via a printed wiring board (PWB) orprinted circuit board (PCB) and placed in front of the circuit to beprotected in the data path.

[0010] One embodiment according to the invention includes a protectioncircuit that protects devices coupled to a signal or data line fromundesired transients on the signal line. The protection circuit isfabricated as a separate circuit and coupled to a circuit to beprotected or can be monolithically integrated with the circuit to beprotected. For example, the protection circuit can be part of a separateintegrated circuit (IC) and attached to a PWB for coupling to thecircuit to be protected. In one embodiment, the protection circuit isrelatively near to an input/output (I/O) port, and the circuit to beprotected is coupled to the I/O port through traces in the PWB that arecoupled to the protection circuit. Advantageously, the protectioncircuit can be formed on the same side of a monolithic epitaxialsubstrate as the devices that are protected by the protection circuit.The monolithic epitaxial substrate can correspond to a Group III-Vcompound semiconductor or a Group IV compound semiconductor. Forexample, the Group III-V compound semiconductor can correspond togallium arsenide (GaAs) substrates and indium phosphide (InP)substrates. Other examples of epitaxial wafers from which the protectioncircuit can be formed include indium gallium phosphide (InGaP), galliumnitride (GaN), aluminum gallium arsenide (AlGaAs), indium galliumarsenide (InGaAs), indium gallium aluminum phosphide (InGaAlP), indiumgallium arsenide phosphide (InGaAsP), indium gallium nitride (InGaN),aluminum gallium nitride (AlGaN), and others currently in existence orlater developed. Examples of Group IV compound semiconductors includesilicon carbide (SiC) and silicon germanium (SiGe), which can be basedon a semi-insulating SiC substrate.

[0011] The protection circuit includes a first steering diode collectionand a second steering diode collection. Embodiments of the protectioncircuit can optionally include a breakdown diode. The first steeringdiode collection and the second steering diode collection can include asingle diode or can include an arrangement of diodes connected inseries. The arrangement of multiple diodes in a stack can increase theforward voltage drop of the arrangement and thereby can advantageouslybe used to protection circuit without a breakdown diode. However, abreakdown diode can also be included in the protection circuit. A diodein the first steering diode collection or the second steering diodecollection is fabricated from a base-collector junction of a transistorconfigured as a diode. In one embodiment, the portion of the transistorconfigured as a diode that would correspond to an emitter is removed by,for example, an etching process.

[0012] An anode of the first steering diode collection is electricallycoupled to the signal line, and a cathode of the first steering diodecollection is electrically coupled to a first reference. The firstreference can include power supply sources and ground. A cathode of thesecond steering diode collection is electrically coupled to the signalline, and an anode of the second steering diode collection iselectrically coupled to a second reference. The second reference caninclude negative power supply sources and ground. In one embodiment, thefirst steering diode collection is electrically coupled to the secondsteering diode collection through a metallization layer.

[0013] One embodiment of the protection circuit further includes abreakdown diode or transient voltage suppression (TVS) diode formed froma base-emitter junction of a transistor configured as the breakdowndiode. Advantageously, the TVS diode can provide protection fromundesired transients on a corresponding power supply line, such asV_(CC). The TVS diode A cathode of the breakdown diode is electricallycoupled to the cathode of the first steering diode collection, and ananode of the breakdown diode is electrically coupled to the anode of thesecond steering diode collection. Advantageously, the breakdown diode isformed on the same side of the monolithic semi-insulating galliumarsenide (GaAs) substrate as the steering diodes and the devices to beprotected.

[0014] In one embodiment, a plurality of first steering diodecollections and a plurality of second steering diode collections, whichare electrically coupled to and protect multiple signal lines, areelectrically coupled to a single breakdown diode, thereby saving spaceand cost.

[0015] One embodiment according to the invention includes a method ofproducing a monolithic integrated chip with built-in transient voltagesuppression. The method provides a substrate assembly made from anepitaxially-grown wafer, such as a Group III-V compound semiconductor,and includes a semi-insulating substrate, an N+ sub-collector layer, anN-type collector layer, a P-type base layer, and an N-type emitterlayer. Selected portions of the N-type emitter layer are removed toisolate transistors and steering diodes. Optionally, selected portionsof the N-type emitter layer are removed to isolate breakdown diodes.Remaining portions of the N-type emitter layer can be used to fabricateemitters for transistors. Where breakdown diodes are also fabricated,selected portions of the N-type emitter layer are also used as cathodesfor breakdown diodes. Selected portions of the P-type base layer arealso removed to isolate transistors and steering diodes. Optionally,selected portions of the P-type base layer are also removed to isolatebreakdown diodes. Remaining portions of the P-type base layer can beused to fabricate bases for transistors and anodes for steering diodes.Where breakdown diodes are fabricated, selected portions of the P-typebase layer are also used as anodes for breakdown diodes. Selectedportions of the N-type collector layer are removed to isolatetransistors and steering diodes. Remaining portions of the N-typecollector layer can be used to fabricate collectors for transistors andcathodes for steering diodes. Where breakdown diodes are alsofabricated, the process selectively removes portions of the N-typecollector layer to isolate breakdown diodes.

[0016] Regions of the N+ sub-collector layer are isolated, byion-implantation techniques and the like, to isolate transistors andsteering diodes. An insulating layer is formed on the selected portionsof the substrate assembly to provide electrical insulation and toprevent contamination of underlying layers. Electrical connections suchas contacts and metallization are formed to electrically couple thetransistors and the steering diodes as applicable. In one embodiment,the method further includes the removal of substantially all of theN-type emitter layer above a portion of a base layer that is used toform an anode of a steering diode.

[0017] One embodiment according to the invention includes a method ofproducing a monolithic integrated chip with built-in transient voltagesuppression. The method provides a substrate assembly made from anepitaxially-grown wafer, such as a gallium arsenide (GaAs) Group III-Vcompound semiconductor, and includes a semi-insulating substrate, an N+sub-collector layer, an N-type collector layer, a P-type base layer, andan N-type emitter layer.

[0018] The method forms a transistor by removing a first portion of theN-type emitter layer, a first portion of the P-type base layer, and afirst portion of the N-type collector layer from around a second portionof the N-type emitter layer, by removing a second portion of the P-typebase layer, and by removing a second portion of the N-type collectorlayer. A first portion or island of the N+ sub-collector layer isisolated by ion implantation, etching techniques, and the like.

[0019] The method forms a steering diode by removing a third portion ofthe N-type emitter layer including substantially all of a portion of theN-type emitter layer above a third portion and a fourth portion of theP-type base layer. The third portion of the P-type base layer and athird portion of the N-type collector layer are removed from around thefourth portion of the P-type base layer and a fourth portion of theN-type collector layer. The fourth portion of the P-type base layer andthe fourth portion of the N-type collector layer are used as an anodeand a cathode, respectively, of the steering diode. At least twosteering diodes on the substrate assembly are electrically coupled to atransistor to protect the transistor on the substrate assembly from anundesired voltage transient.

[0020] In one embodiment, the method further forms a breakdown diode byusing a base of the transistor as an anode of the breakdown diode and byusing an emitter of the transistor as a cathode of the breakdown diode.In another embodiment, the method forms a breakdown diode by using abase of the transistor as an anode of the breakdown diode and by using acollector of the transistor as a cathode of the breakdown diode.

[0021] Another embodiment includes a method of producing a monolithicintegrated chip with transient voltage suppression from a monolithicepitaxial semiconductor substrate with a semi-insulating substrate, a P+sub-collector layer, a P-type collector layer, an N-type base layer, anda P-type emitter layer.

[0022] Another embodiment according to the invention includes a methodof using pre-grown layers in a monolithic substrate assembly made from aGroup III-V compound semiconductor such as gallium arsenide (GaAs) toform a transient voltage protection circuit. The method includesfabricating collector regions for transistors and cathode regions forsteering diodes from an N-type collector layer. Base regions fortransistors and anode regions for steering diodes are fabricated from aP-type base layer. Emitter regions for transistor and cathode regionsfor breakdown diodes are fabricated from an N-type emitter layer.

[0023] An anode of a first steering diode is electrically coupled to adata line that is also electrically coupled to a transistor. A cathodeof the first steering diode is electrically coupled to a first referenceto protect the transistor from an undesired positive-going voltagetransient. A cathode of a second steering diode is electrically coupledto the anode of the first steering diode and to the data line. An anodeof the second steering diode is electrically coupled to a secondreference to protect the transistor from an undesired negative-goingvoltage transient. One embodiment of the method further fabricates acathode and an anode of a breakdown diode from the N-type emitter layerand the P-type base layer, respectively. The breakdown diode iselectrically coupled to steering diodes to protect against voltagetransients on reference lines such as power and ground.

[0024] One embodiment includes a method of protecting a device on amonolithic gallium arsenide (GaAs) chip from undesired voltagetransients on a signal line. The method includes clamping the signalline to a first positive voltage when the chip is in a powered-on statein response to an undesired voltage transient with a positive-goingspike, where the first positive voltage is a multiple of a forwardvoltage drop of a monolithically integrated diode above a power supplyvoltage that is supplied to the monolithic chip. The method furtherincludes clamping the signal line to a second positive voltage when themonolithic chip is in a powered-off state, where the second positivevoltage is a sum of the first multiple of the forward voltage drop ofthe monolithically integrated diode and a reverse breakdown voltage of abreakdown diode that is also integrated into the monolithic chip. Themethod further includes clamping the signal line to a negative voltagethat is a multiple of a forward voltage drop of a monolithicallyintegrated diode below a ground potential in response to an undesiredvoltage transient with a negative-going spike. In addition, oneembodiment further includes protecting multiple signal lines throughmultiples steering diodes that are coupled to a common breakdown diodeon the monolithic chip.

BRIEF DESCRIPTION OF THE DRAWINGS

[0025] These and other features of the invention will now be describedwith reference to the drawings summarized below. These drawings and theassociated description are provided to illustrate preferred embodimentsof the invention and are not intended to limit the scope of theinvention.

[0026]FIG. 1 illustrates a transient voltage protection circuitaccording to an embodiment the invention.

[0027]FIG. 2 illustrates a steering diode collection.

[0028]FIG. 3A illustrates one embodiment of a transient voltageprotection circuit adapted to protect multiple data lines.

[0029]FIG. 3B illustrates another embodiment of a transient voltageprotection circuit adapted to protect multiple data lines.

[0030]FIG. 4 illustrates a process for fabricating a transient voltageprotection circuit.

[0031]FIG. 5 is a cross-sectional view of an exemplary layout of atransient voltage protection circuit.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0032] Although this invention will be described in terms of certainpreferred embodiments, other embodiments that are apparent to those ofordinary skill in the art, including embodiments which do not provideall of the benefits and features set forth herein, are also within thescope of this invention. Accordingly, the scope of the invention isdefined only by reference to the appended claims.

[0033] While illustrated in the context of gallium arsenide (GaAs), theskilled artisan will appreciate that the principles and advantagesdescribed herein are applicable to other types of epitaxial wafers,including epitaxial wafers fabricated from indium phosphide (InP) andthe like.

[0034]FIG. 1 illustrates a transient voltage protection circuit 100according to an embodiment the invention. The transient voltageprotection circuit 100 limits an undesired voltage transient on a dataline 102 to a safe level to protect transistors and other devices thatare electrically coupled to the data line 102.

[0035] The data line 102 is electrically coupled to an anode of a firststeering diode 104, D₁, and to a cathode of a second steering diode 106,D₂. As will be described later in connection with FIGS. 4 and 5, thefirst steering diode 104, D₁, and the second steering diode 106, D₂, canbe fabricated from epitaxial layers on a monolithic chip that areintended to be used to fabricate a base-collector junction of a compoundsemiconductor transistor.

[0036] The first steering diode 104, D₁, suppresses positive-goingvoltage transients on the data line 102. The second steering diode 106,D₂, suppresses negative-going voltage transients on the data line 102.In the embodiment illustrated in FIG. 1, the first steering diode 104,D₁, and the second steering diode 106, D₂, are drawn as single diodes.However, in other embodiments, the first steering diode 104, D₁, and thesecond steering diode 106, D₂, can include multiple diodes as will bedescribed later in connection with FIG. 2. The stacking of multiplediodes can be advantageously used to select a forward voltage dropacross the first steering diode 104, D₁, or the second steering diode106, D₂. The selected voltage drop can be used to select the voltagethreshold levels at which the transient voltage protection circuit 100clamps the undesired voltage transients on the data line 102.

[0037] In the illustrated embodiment of the transient voltage protectioncircuit 100, a cathode of the first steering diode 104, D₁, iselectrically coupled to a voltage supply 108, V_(CC). The voltage supply108, V_(CC), can be the source of power to the protected circuit.However, it will be understood by one of ordinary skill in the art thatother voltage references, including ground, can also be used. In anotherembodiment described later in connection with FIG. 3B, rather thanelectrically couple the cathode of the first steering diode 104, D₁, tothe voltage supply 108, V_(CC), the cathode of the first steering diode104, D₁, is electrically coupled to ground, and the first steering diode104, D₁, includes multiple diodes to increase the forward voltage dropof the first steering diode 104, D₁, such that normal signals on thedata line 102 are not undesirably suppressed.

[0038] Under normal operating conditions, i.e., without an undesiredvoltage transient, the first steering diode 104, D₁, is in areverse-biased state or is in an unbiased state. When an undesiredpositive-going voltage transient is encountered on the data line 102,the positive-going voltage transient forward biases the first steeringdiode 104, D₁. The positive-going voltage transient is thereby clampedto a voltage level that is approximately the sum of the forward voltagedrop of the first steering diode 104, D₁, (about 1 volt) and the voltageof the voltage reference. In the illustrated embodiment, the voltagereference is the voltage supply 108, V_(CC). Where voltage transientprotection with a relatively low clamping voltage and with symmetricalbi-directional operation is desired, the embodiment described later inconnection with FIG. 3B can be used.

[0039] An anode of the second steering diode 106, D₂, is electricallycoupled to a ground 110. Under normal operating conditions, the secondsteering diode 106, D₂, is also in a reverse-biased state or in anunbiased state. When an undesired negative-going voltage transient isencountered on the data line 102, the negative-going voltage transientforward biases the second steering diode 106, D₂. The negative-goingvoltage transient is thereby clamped to a voltage level that is belowground potential by the amount of the forward voltage drop of the secondsteering diode 106, D₂.

[0040] In another embodiment, the transient voltage protection circuit100 optionally includes a breakdown diode 112, D₃ or transient voltagesuppression (TVS) diode. As will be described later in connection withFIGS. 4 and 5, the breakdown diode 112, D₃, can be fabricated fromepitaxial layers on a monolithic chip that are intended to be used tofabricate a base-emitter junction of a compound semiconductortransistor. In one embodiment, the reverse breakdown voltage of thebase-emitter junction used for the breakdown diode 112, D₃, is about 7volts. The breakdown diode 112, D₃, can also be fabricated from abase-collector junction of a compound semiconductor transistor. In oneembodiment, the reverse breakdown voltage of the base-collector junctionused for the breakdown diode 112, D₃, is about 11 volts. In theillustrated embodiment, a cathode of the breakdown diode 112, D₃, iselectrically coupled to the cathode of the first steering diode 104, andto the voltage supply 108, V_(CC). An anode of the breakdown diode 112,D₃, is electrically coupled to the anode of the second steering diode106, D₂, and to the ground 110. In some embodiments, multiple sets ofsteering diodes are electrically coupled to a common breakdown diode aswill be described later in connection with FIG. 3A.

[0041] Under normal conditions, the breakdown diode 112, D₃, is reversedbiased below the reverse breakdown voltage of the breakdown diode 112,D₃, so that under these normal conditions, there is relatively lowconductivity across the breakdown diode 112, D₃. When an undesiredvoltage transient on the voltage supply 108, V_(CC), or some otherreference, exceeds the reverse breakdown voltage of the breakdown diode112, D₃, the breakdown diode 112, D₃, exhibits relatively highconductivity in the reverse-biased direction. The relatively highconductivity clamps the undesired voltage transient to a safe level. Theaction of the breakdown diode 112, D₃, protects other deviceselectrically coupled to the voltage supply 108, V_(CC) from undesiredtransients. In addition, the breakdown diode 112, D₃, can also be usedby steering diodes to divert undesired voltage transients on the dataline 102 when the corresponding chip is in a powered-off state.

[0042]FIG. 2 illustrates a steering diode collection 200 with multiplediodes arranged in a stack. As described earlier in connection with FIG.1, a steering diode can include one or more diodes. The steering diodecollection 200 can include a broad range of diodes, from a single diodeto multiple diodes as shown in FIG. 2.

[0043] In the illustrated steering diode collection 200, N individualdiodes are arranged in a series-connected stack. The value of N can varyin a broad range. The steering diode collection 200 includes a firstdiode 202, a second diode 204, a third diode 206, and an N-th diode 208.The polarities of the first diode 202, the second diode 204, the thirddiode 206, and the N-th diode 208 are arranged in the same orientationsuch that forward biasing the steering diode collection 200 forwardbiases all of the individual diodes within the steering diode collection200. For example, a cathode of the first diode 202 is the cathode of thesteering diode collection 200. An anode of the first diode 202 iselectrically coupled to a cathode of the second diode 204. An anode ofthe second diode 204 is electrically coupled to a cathode of the thirddiode 206 and so forth.

[0044] The series connection of multiple diodes allows the forward dropof the steering diode collection 200 to be selected. Advantageously, theforward voltage drop can be selected such that a protection circuitprovides clamping at a low clamping voltage. Where, for example, thesteering diode collection 200 includes N diodes arranged in aseries-connected stack, the corresponding forward voltage drop of thesteering diode collection is the aggregate sum of the N individualforward voltage drops. For example, where there are 3 gallium arsenide(GaAs) diodes arranged in a stack, each with a voltage drop of about 1.1volts, the corresponding voltage drop of the stack is about 3.3 volts.The series connection of multiple diodes can also result in thereduction of capacitance of the stack of diodes relative to the amountof capacitance of a single diode within the stack. For example, where C₁and C₂ express the junction capacitance of a first steering diode andthe junction capacitance of a second steering diode, respectively, thecapacitance of the series combination of the first steering diode andthe second steering diode is approximately C_(T), as expressed byEquation 1. It will be understood by one of ordinary skill in the artthat the actual capacitance of the series combination will vary fromEquation 1 due to parasitics and biasing of the diode junctions.$\begin{matrix}{\frac{1}{C_{T}} \approx {\frac{1}{C_{1}} + \frac{1}{C_{2}}}} & \left( {{Eq}.\quad 1} \right)\end{matrix}$

[0045]FIG. 3A illustrates one embodiment of a transient voltageprotection circuit 300 adapted to protect multiple data lines fromundesired voltage transients. Advantageously, the transient voltageprotection circuit 300 couples pluralities of steering diodes to acommon breakdown diode to reduce the component count for a protectioncircuit that incorporates the breakdown diode. The breakdown diode canprotect devices that are coupled to a power source, such as V_(CC) fromundesired transients on V_(CC) and can also protect against voltagetransients that occur when a device is disconnected from a power sourcesuch as V_(CC). The illustrated transient voltage protection circuit 300protects N number of data lines. The value for N, the number of datalines protected, can vary in a broad range.

[0046] The transient voltage protection circuit 300 shown in FIG. 3Aprotects a first data line 302, a second data line 304, a third dataline 306, and an N-th data line 308 from the undesired transients. Thefirst data line 302 is electrically coupled to an anode of a firststeering diode 310, D_(S1A), and to a cathode of a second steering diode312, D_(S1B). A cathode of the first steering diode 310, D_(S1A), iselectrically coupled to a first reference shown here as V_(CC) and to acathode of a breakdown diode 314, D_(B). An anode of the second steeringdiode 312, D_(S1B), is electrically coupled to ground and to an anode ofthe breakdown diode 314, D_(B). In response to an undesiredpositive-going voltage transient on the first data line 302, the firststeering diode 310, D_(S1A), couples the transient to V_(CC) and to thecathode of the breakdown diode 314, D_(B), to protect the first dataline 302 and other devices coupled to the first data line 302, from thepositive-going voltage transient. In response to a negative-goingvoltage transient on the first data line 302, the second steering diode312, D_(S1B), couples the transient to ground and to the anode of thebreakdown diode 314, D_(B), to protect the first data line 302 and otherdevices coupled to the first data line 302, from the negative-goingvoltage transient.

[0047] A third steering diode 316, D_(S2A), and a fourth steering diode318, D_(S2B), protect the second data line 304 from undesiredtransients. The third steering diode 316, D_(S2A), protects the seconddata line 304 by coupling positive-going transients to V_(CC) and to thebreakdown diode 314 D_(B). The fourth steering diode 318, D_(S2B),protects the second data line 304 from an undesired negative-goingtransient by coupling the negative-going transient to ground and to thebreakdown diode 314, D_(B). Advantageously, the third steering diode316, D_(S2A), and the fourth steering diode 318, D_(S2B), couple to thesame breakdown diode 314, D_(B), as the first steering diode 310,D_(S1A), and the second steering diode 312, D_(S1B), to economicallyshare the breakdown diode 314, D_(B).

[0048] Similarly, a fifth steering diode 320, D_(S3A), and a sixthsteering diode 322, D_(S3B), couple to the third data line 306 toprotect the third data line 306 from undesired transients. The fifthsteering diode 320, D_(S3A), and the sixth steering diode 322, D_(S3B),also share the breakdown diode 314, D_(B). A seventh steering diode 324,D_(SNA), and an eighth steering diode 326, D_(SNB), are coupled to theN-th data line 308 and also share the breakdown diode 314, D_(B), toprotect the N-th data line 308 from undesired transients.

[0049]FIG. 3B illustrates another embodiment of a transient voltageprotection circuit 350, which is adapted to protect multiple data lines.Devices that are coupled to the first data line 302, the second dataline 304, the third data line 306, and the N-th data line 308 areprotected by the transient voltage protection circuit 350.Advantageously, the transient voltage protection circuit 350 can beconfigured to provide symmetrical clamping of undesired voltagetransients on the data lines. It will be understood by one of ordinaryskill in the art that the number of data lines that can be protected bythe transient voltage protection circuit 350 can vary in a very broadrange, i.e., the value of N can vary in a broad range.

[0050] The first data line 302, the second data line 304, the third dataline 306, and the N-th data line 308 are coupled to anodes of a firststeering diode 352, D_(S1A), a second steering diode 354, D_(S2A), athird steering diode 356, D_(S3A), and a fourth steering diode 358,D_(SNA), respectively. The cathodes of the first steering diode 352,D_(S1A), the second steering diode 354, D_(S2A), the third steeringdiode 356, D_(S3A), and the fourth steering diode 358, D_(SNA), arecoupled to ground. The first steering diode 352, D_(S1A), the secondsteering diode 354, D_(S2A), the third steering diode 356, D_(S3A), andthe fourth steering diode 358, D_(SNA), thereby clamp undesiredpositive-going voltage transients on the first data line 302, the seconddata line 304, the third data line 306, and the N-th data line 308,respectively, to the forward voltage drop (V_(F)) (above groundpotential) associated with the steering diodes 352, 354, 356, 358, i.e.,to +V_(F).

[0051] The first data line 302, the second data line 304, the third dataline 306, and the N-th data line 308 are also coupled to cathodes of afifth steering diode 360, D_(S1B), a sixth steering diode 362, D_(S2B),a seventh steering diode 364, D_(S3B), and an eighth steering diode 366,D_(SNB), respectively. The anodes of the fifth steering diode 360,D_(S1B), the sixth steering diode 362, D_(S2B), the seventh steeringdiode 364, D_(S3B), and the eighth steering diode 366, D_(SNB), arecoupled to ground. The fifth steering diode 360, D_(S1B), the sixthsteering diode 362, D_(S2B), the seventh steering diode 364, D_(S3B),and the eighth steering diode 366, D_(SNB), thereby clamp negative-goingvoltage transients on the first data line 302, the second data line 304,the third data line 306, and the N-th data line 308, respectively, tothe forward voltage drop (V_(F)) (below ground potential) associatedwith the steering diodes 360, 362, 364, 366, i.e., to −V_(F).

[0052] Advantageously, where the forward drops (V_(F)) of the firststeering diode 352, D_(S1A), the second steering diode 354, D_(S2A), thethird steering diode 356, D_(S3A), and the fourth steering diode 358,D_(SNA), and the forward drops (V_(F)) of the fifth steering diode 360,D_(S1B), the sixth steering diode 362, D_(S2B), the seventh steeringdiode 364, D_(S1B), and the eighth steering diode 366, D_(SNB), are thesame, the clamping provided by the transient voltage protection circuit350 is symmetrical with respect to ground. The skilled practitioner willappreciate that the forward drop (V_(F)) of, for example, the firststeering diode 352, D_(S1A), and the forward drop (V_(F)) of the fifthsteering diode 360, D_(S1B), are the same when the first steering diode352, D_(S1A), and the fifth steering diode 360, D_(S1B), include thesame number of diodes.

[0053] The transient voltage protection circuit 350 can further includea breakdown diode 368, D_(B), which protects a voltage supply or areference, such as V_(CC), against undesired voltage transients.

[0054]FIG. 4 illustrates a process 400 for fabricating a transientvoltage protection circuit from an epitaxial wafer, such as a GroupIII-V compound semiconductor monolithic substrate. In a conventionalsilicon monolithic substrate, a component is laterally formed by formingemitter, base, and collector regions in the substrate by such methods asdiffusion and ion implantation. By contrast, an epitaxial wafer, such asa Group III-V compound semiconductor monolithic substrate, has pre-grownepitaxial emitter, base, and collector regions. Portions of thepre-grown emitter, base, and collector regions are selectively removedby etching processes and the like to form devices, such as transistorsand diodes. Although the process will be described in the context offabricating transistors, breakdown diode, and steering diodes, it willbe understood that in some embodiments, some devices, such as breakdowndiodes, are not fabricated. In addition, it will be understood that theprocess can be varied in a number of ways, including variations in thesequence or order in which the various steps have been presented.

[0055] The process provides 404 a substrate assembly from which thetransient voltage protection circuit is to be fabricated. The substrateassembly can be part of a relatively large wafer and can includepluralities of transient voltage protection circuits, which arefabricated at the same time. In one embodiment, the substrate assemblyincludes, from bottom to top, a semi-insulating substrate layer, asub-collector layer, a collector layer, a base layer, and an emitterlayer. For example, in one embodiment, the substrate assembly includes asemi-insulating substrate, an N+ sub-collector layer, an N-typecollector layer, a P-type base layer, and an N-type emitter layer. Inanother embodiment, the substrate assembly corresponds to asemi-insulating substrate, a P+ sub-collector layer, a P-type collectorlayer, an N-type base layer, and a P-type emitter layer.

[0056] The process proceeds to form emitter layer 408 on the substrateassembly. The contacts provide low resistance to and adhesion betweenthe various emitter portions of the substrate assembly andmetallization, which is deposited later. In addition, the contact canprovide a barrier against the undesired diffusion of atoms from themetallization to the substrate.

[0057] The process proceeds to remove 412 selected undesired portions ofthe emitter layer. Portions of the emitter layer are removed toelectrically isolate devices from each other and to provide access toother layers for further removal or to make electrical contact. Avariety of standard processes can be used to remove the undesiredportions. These processes can include photoresist processes, dry or wetetching processes, and the like. The portions of the emitter layerremoved include portions surrounding transistors, breakdown diodes, andsteering diodes that are to be made. The portions of the emitter layerremoved can also include portions above the base layer for transistors,breakdown diodes, and steering diodes.

[0058] A portion of the emitter layer is removed above transistors andbreakdown diodes that are to be formed. This allows a contact ormetallization to be formed on the base layer of the transistor or thebreakdown diode to provide electrical coupling to the base of thetransistor or to the anode of the breakdown diode. It will be understoodby one of ordinary skill in the art that the entire area of the emitterlayer above the base layer of the transistor or breakdown diode is notremoved because a portion of the emitter layer remains to form anemitter for the transistor or a cathode for the breakdown diode.

[0059] The portions removed also include the area above an anode of asteering diode so that a contact can be deposited on the correspondingportion of the base layer to provide electrical continuity to the anodeof the steering diode. In one embodiment, all of the area above theanode of a steering diode is removed. However, the skilled practitionerwill appreciate that an electrical contact with the anode can also bemade with the removal of only a portion of the emitter layer area abovethe anode of the steering diode.

[0060] The process proceeds to remove 416 selected undesired portions ofthe base layer and selected undesired portions of the collector layer.Portions of the base layer are removed to electrically isolate devicesfrom each other and to provide access to other layers for furtherremoval or to make electrical contact with a portion of a layer furtherbelow the base layer. The portions of the base layer removed includeportions surrounding transistors, breakdown diodes, and steering diodesthat are to be made.

[0061] Portions of the collector layer are removed to electricallyisolate devices from each other and to provide access to other layersfor further removal or to make electrical contact with a layer furtherbelow the collector layer. The portions of the collector layer removedinclude portions surrounding transistors, breakdown diodes, and steeringdiodes that are to be made. It will be understood by one of ordinaryskill in the art that the portions of the collector layer removedinclude portions around the collector layer of a breakdown diode, eventhough the collector layer of the breakdown diode is not used by thebreakdown diode as either an anode or as a cathode. In one embodiment,the process removes 416 selected undesired portions of the base layerand selected undesired portions of the collector layer with two etchingsteps. In a first step, the process removes selected relatively thinportions of the emitter layer that had been removed 412 incompletely andremain on top of portions of the base layer. In a second step, theprocess removes selected portions of the base layer and the collectorlayer to form mesa-like structures for the diodes and transistors asdescribed later in connection with FIG. 5. In one embodiment, the firststep and the second step use etching techniques to remove the materialfrom the appropriate layers.

[0062] The process proceeds to form base layer contacts 420 on thesubstrate assembly. The contacts provide low resistance to and adhesionbetween the various base portions of the substrate assembly andmetallization, and also provide barrier against the undesired diffusionof atoms from the metallization to the applicable portion of thesubstrate assembly.

[0063] The process proceeds to form collector layer contacts 424 on thesubstrate assembly. The contacts provide low resistance to and adhesionbetween the various collector portions of the substrate assembly andmetallization, and provides a barrier against the undesired diffusion ofatoms from the metallization to applicable portion of the substrateassembly.

[0064] The process proceeds to isolate 432 regions in the sub-collectorlayer. In one embodiment, ion-implantation techniques are used to createisolation regions in the sub-collector layer. In another embodiment,etching techniques are used to remove and thereby isolate regions in thesub-collector layer. Examples of dopants that can be implanted to formisolation regions include helium, beryllium, hydrogen, boron, andothers. Regions of the sub-collector that are not ion implanted exhibitrelatively high conductivity and can be used as an electrical conductorcoupled to the collector layer of a corresponding transistor or acorresponding steering diode. The collector layer of the transistor orthe steering diode is used to fabricate a collector for the transistoror a cathode for the breakdown diode. The ion-implanted regions in thesub-collector layer exhibit a relatively large amount of resistance,thereby separating the sub-collector layer into islands of relativelyhigh conductivity underneath a collector of a transistor or a cathode ofa breakdown diode. In one embodiment, the relatively high conductivityof the sub-collector layer is used to electrically couple the collectorof a corresponding transistor or the cathode of a corresponding steeringdiode to an interconnect such as a contact or a metallization layer.

[0065] The process proceeds to form 436 insulating or dielectric regionsfor protective layers and for electrical insulation. In one embodiment,the process deposits a film of silicon nitride (SiN) using a standardprocess such as a low pressure chemical vapor deposition (LPCVD)process, and undesired portions of the film are removed by standardprocessing techniques such as photoresist and etching processes. It willbe understood by one of ordinary skill in the art that other materials,such as silicon oxide (SiO₂) can be substituted for silicon nitride(SiN), but that silicon nitride (SiN) provides a superior protectivelayer. The insulating regions prevent undesired electrical coupling withcontacts and metallization. The insulating regions also protect theunderlying substrate materials against the diffusion of impurities andmoisture. In addition, openings can be formed in the dielectric layer toprovide access to devices below the protective layer. It will beunderstood by one of ordinary skill in the art that the application of adielectric layer can be repeated many times, particular where theinterconnects between devices use multi-layer metallization.

[0066] The process proceeds to form thin film resistors 440, asapplicable, on the substrate assembly. Although the transient voltageprotection circuits described herein do not need thin film resistors, itwill be understood by one of ordinary skill in the art that othercircuits, including those that are protected by transient voltageprotection circuits, can be fabricated at the same time on the samewafer, and that these other circuits may include such thin filmresistors. The thin film resistors can be formed from, for example,nickel chromium (NiCr).

[0067] The process proceeds to form thin film capacitors 442, asapplicable, on the substrate assembly. Although the transient voltageprotection circuits described herein do not need thin film capacitors,the skilled practitioner will appreciate that other circuits, includingcircuits that are protected by transient voltage protection circuits,can be fabricated at the same time on the same wafer, and that theseother circuits may include such thin film capacitors. The thin filmcapacitors can be formed from a variety of materials, such as fromsilicon nitride (SiN) dielectric materials, and electrodes.

[0068] The process proceeds to form metallization layers 444. Themetallization layers are used to build interconnects between devices,such as between a steering diode and a transistor. Advantageously, suchinterconnects do not utilize mechanical bond wire connections and thelike, which are both expensive and unreliable. A variety of metals andalloys can be used for the metallization. In one embodiment, themetallization is formed from an alloy of titanium platinum gold(TiPtAu). A variety of processes can be used to deposit themetallization. These processes include physical vapor deposition (PVD)techniques such as evaporation, and can include chemical vapordeposition (CVD) techniques. Undesired portions of the metallization canbe removed by, for example, a lift off processes. The deposition ofmetallization layers and the deposition of dielectric layers can berepeated as necessary to form the interconnects. Where a barrier is notrequired, polyimide can be deposited as the insulating or dielectriclayer for use as the interlayer dielectric.

[0069] The process proceeds to form contact pads 448 on the substrateassembly. The contact pads are used to attach to other circuits or tothe appropriate pins of the IC package through bond wires and the like.

[0070] The process proceeds to form backside vias 452. An example of abackside via is described later in connection with FIG. 5. The backsidevia is an alternative way to electrically access a contact for acollector and can provide a better connection to ground through thebottom of the corresponding die. The process patterns a trench from thebackside of the substrate assembly to a contact on the topside of thesubstrate assembly. In one embodiment, the process evaporates a metal,such as titanium tungsten/gold (TiW/Au), and electroplates gold (Au) toform a sheet.

[0071] The process proceeds to form backside scribe lanes 456 byremoving, via etching techniques and the like, undesired areas of thegold (Au) that was deposited on the backside. The gold (Au) that remainsacts as a conductor for the backside via.

[0072] As will be appreciated by the skilled practitioner, the processcan further include steps such as die separation and wire bonding of themetallization to the appropriate pins of the IC package.

[0073]FIG. 5 is a cross-sectional view of an exemplary layout of atransient voltage protection circuit. The transient voltage protectioncircuit is fabricated from a monolithic substrate of a Group III-Vcompound semiconductor such as gallium arsenide (GaAs), indium phosphide(InP), and the like. The monolithic substrate includes pre-grown layers,which are processed as described earlier in connection with FIG. 4 toproduce the transient voltage protection circuit.

[0074] While illustrated in the context of a semi-insulating substrate,an N+ sub-collector layer, an N-type collector layer, a P-type baselayer, and an N-type emitter layer, it will be understood by one ofordinary skill in the art that the principles and advantages describedin connection with FIG. 5 are applicable to a semi-insulating substrate,a P+ sub-collector layer, a P-type collector layer, an N-type baselayer, and a P-type emitter layer.

[0075] One embodiment of the transient voltage protection circuitincludes a semi-insulating substrate 502, such as a substrate of galliumarsenide (GaAs). Advantageously, a gallium arsenide (GaAs) substrate hasa much higher resistivity than a silicon (Si) substrate, which allowsdevices to be more easily isolated and reduces leakage currents therebyenhancing battery life in portable electronics. In one embodiment, theleakage current from a protected data line to a reference is less than 1microamp (uA).

[0076] Above the semi-insulating substrate 502 is an N+ sub-collectorlayer, from which islands of relatively conductive materials andisolation regions are formed. As illustrated in FIG. 5, a firstisolation region 504, a first N+ sub-collector island 506, a secondisolation region 508, a second N+ sub-collector island 510, a thirdisolation region 512, and a third N+ sub-collector island 514 are formedin the N+ sub-collector layer. It will be understood by one of ordinaryskill in the art that the isolation regions, as shown by the firstisolation region 504, the second isolation region 508, and the thirdisolation region 512, may form ring-like structures which surround thesub-collector islands of the respective devices and, in fact, may bepart of the same isolation region such that, for example, the firstisolation region 504 and the second isolation region 508 are part of thesame isolation region. The isolation regions allow electrical isolationof islands within the N+ sub-collector layer such as electricalisolation of the first N+ sub-collector island 506 from the second N+sub-collector island 510. The isolation region can be formed by avariety of techniques, such as by ion implantation and by etching.

[0077] Above the first N+ sub-collector island 506 is a cathode 516 of afirst steering diode. By way of example, the first steering diodeillustrated in FIG. 5 can correspond to the first steering diode 104,D₁, described earlier in connection with FIG. 1. The cathode 516 isformed from the collector layer, which is also used to form collectorsfor transistors. In the illustrated cross section, the cathode 516 iselectrically coupled to a first electrode 518 through the first N+sub-collector island 506 and a contact 517. The contact 517 is formedunder the first electrode 518 to provide low resistance to and greateradhesion to the first N+ sub-collector island 506 and/or to provide abarrier against the undesired diffusion of atoms from the firstelectrode 518 to the first N+ sub-collector island 506. The firstelectrode 518 can be electrically coupled to a first reference, such asthe voltage supply 108, V_(CC), described earlier in connection withFIG. 1.

[0078] Above the cathode 516 is an anode 520 of the first steeringdiode. The anode 520 is formed from a base layer that is also used toform bases for transistors. In the illustrated embodiment, the emitterlayer above the anode 520 has been etched away and a first contact 522is deposited on the anode 520 to provide electrical coupling to a secondelectrode 524.

[0079] A dielectric such as silicon nitride (SiN) is deposited to form afirst insulator 526 and a second insulator 528. The first insulator 526prevents the first electrode 518 from undesirably electrically couplingto an adjacent device. The second insulator 528 is deposited around thecathode 516 and the anode 520 of the first steering diode and similarlyprevents the undesired electrical coupling of the first electrode 518and/or the second electrode 524 to portions of the first N+sub-collector island 506, the cathode 516, and the anode 520.

[0080] The second electrode 524 electrically couples the anode 520 ofthe first steering diode to the second N+ sub-collector island 510through a fourth contact 523. The fourth contact 523 provides lowresistance to and adhesion to the second N+ sub-collector island 510 andprovides a barrier against the diffusion of atoms from the secondelectrode 524 to the substrate assembly. The second N+ sub-collectorisland 510 is coupled to a cathode 530 of a second steering diode, whichcan correspond to the second steering diode 106 described earlier inconnection with FIG. 1. Advantageously, the second electrode 524 therebycouples the anode 520 of the first steering diode to the cathode 530 ofthe second steering diode without the need for relatively fragile,expensive, and highly inductive bond wires. In one embodiment, the firstand the second steering diodes are located adjacent to the devices whichare to be protected by the transient voltage protection circuit so thatthe second electrode 524 electrically couples to the protected line,such as the data line 102 described earlier in connection with FIG. 1.Of course, when the corresponding integrated circuit is assembled in apackage, a bond wire can be used to attach the second electrode 524 toan external signal via a package pin.

[0081] The cathode 530 of the second steering diode is formed from thecollector layer, which is also used to form collectors of transistors.Above the cathode 530 of the second steering diode is an anode 532 ofthe second steering diode. The anode 532 is formed from the base layer,which is also used to form bases of transistors. The emitter layer abovethe anode 532 is either partially or wholly etched away, and a secondcontact 534 is formed on top of the anode 532. The second contact 534can be used to provide low resistance to and adhesion between a thirdelectrode 536 and the anode 532 and/or can be used as a barrier toprevent the undesired diffusion of atoms from the third electrode 536 tothe anode 532.

[0082] A third insulator 538 is deposited around the cathode 530 and theanode 532 of the second steering diode. The third insulator 538 preventsthe undesired electrical coupling of the cathode 530 and the anode 532to conductors such as the second electrode 524 and the third electrode536. In addition, the third insulator 538 can protect the cathode 530and the anode 532 from the undesired diffusion of impurities andmoisture.

[0083] A breakdown diode is formed above the third N+ sub-collectorisland 514. In the illustrated embodiment, the breakdown diode is formedfrom a base-emitter junction of a transistor, and the collector of thetransistor is electrically shorted to the base. The breakdown diode cancorrespond to the breakdown diode 112 described earlier in connectionwith FIG. 1. Above the third N+ sub-collector island 514 is a collector540. The collector 540 is formed from the collector layer. The collector540 is unused where the transistor is configured as the breakdown diode,and the collector 540 is electrically shorted by the third electrode 536to an anode 542 of the breakdown diode. The third electrode 536 couplesto the collector 540 through the third N+ sub-collector island 514 and athird contact 515. The third electrode 536 couples to the anode 542 ofthe breakdown diode through a fifth contact 543. In one embodiment, thethird electrode 536 is further coupled to a reference, such as to theground 110 described earlier in connection with FIG. 1. In oneembodiment, the ground 110 is provided through a seventh contact 552 anda backside via 554.

[0084] The anode 542 is formed from the base layer, which is also usedto fabricate bases of transistors. It will be understood by one ofordinary skill in the art that a contact of a barrier metal can also beformed between the collector 540 and the third electrode 536 and/orbetween the anode 542 and the third electrode 536. A fourth insulator544 prevents the undesired diffusion of atoms from the third electrode536 to the collector 540 and the anode 542, and also protects thecollector 540, the anode 542, and a cathode 546 of the breakdown diodefrom the undesired diffusion of impurities and moisture.

[0085] The cathode 546 is formed from the emitter layer above the anode542. The emitter layer can also be used to form emitters of transistors.A portion of the cathode 546 is removed from the surface of the anode542 such that a contact and/or the third electrode 536 can form on theanode 542 to provide electrical coupling to the anode 542. A fifthinsulator 548 provides electrical isolation between the third electrode536 and a fourth electrode 550, which is coupled to the anode 542through a sixth contact 551. One embodiment further includes a contactbetween the fourth electrode 550 and the cathode 546 to prevent theundesired diffusion of atoms from the fourth electrode 550 to thecathode 546. In one embodiment, a bond wire electrically couples thefourth electrode 550 and hence, the cathode 546 of the breakdown diodeto a reference such as the voltage supply 108, V_(CC), described earlierin connection with FIG. 1.

[0086] In one embodiment, a ground connection is provided through thebackside of the substrate assembly. A layer of gold (Au) 556 can providea ground connection to the backside via 554. In one embodiment, thelayer of gold (Au) 556 is formed by electroplating gold over anevaporated metal or alloy, such as a layer of titanium tungsten/gold(TiW/Au). The backside via 554 allows the ground reference to cross overfrom the backside of the substrate assembly to the topside and toconnect to the transient voltage protection circuit. For example, thebackside via 554 couples the ground reference to the seventh contact552, which in turn couples the ground to the third N+ sub-collectorisland 514, which conducts the ground to the third electrode 536 throughthe third contact 515. Where isolation is needed, a fourth isolationregion 558 provides electrical isolation between the ground providedthrough the seventh contact 552 and an adjacent circuit.

[0087] Various embodiments of the invention have been described above.Although this invention has been described with reference to thesespecific embodiments, the descriptions are intended to be illustrativeof the invention and are not intended to be limiting. Variousmodifications and applications may occur to those skilled in the artwithout departing from the true spirit and scope of the invention asdefined in the appended claims.

What is claimed is:
 1. A method of producing a monolithic integratedchip with built-in transient voltage suppression, the method comprising:providing a monolithic, epitaxially-grown substrate assembly, whereinthe substrate assembly includes: a semi-insulating substrate; an N+sub-collector layer; an N-type collector layer; a P-type base layer; andan N-type emitter layer; removing selected portions of the N-typeemitter layer to isolate transistors and steering diodes, where at leasta remaining portion of the N-type emitter layer is used to fabricateemitters for transistors; removing selected portions of the P-type baselayer to isolate transistors and steering diodes, where at least aremaining portion of the P-type base layer is used to fabricate basesfor transistors and anodes for steering diodes; removing selectedportions of the N-type collector layer to isolate transistors andsteering diodes, where at least a remaining portion of the N-typecollector layer is used to fabricate collectors for transistors andcathodes for steering diodes; isolating regions in the N+ sub-collectorlayer such that transistors and steering diodes are electricallyisolated; forming an insulating layer on selected portions the substrateassembly; and forming electrical connections to the transistors andsteering diodes.
 2. The method as defined in claim 1, wherein theremoving selected portions of the N-type emitter layer further comprisesremoving all of the N-type emitter layer above a portion of a base layerthat is used to form an anode of a steering diode.
 3. The method asdefined in claim 1, wherein the isolating regions comprisesion-implanting isolation regions in the N+ sub-collector layer.
 4. Themethod as defined in claim 1, wherein the monolithic epitaxially-grownsubstrate assembly comprises at least one of gallium arsenide (GaAs),indium gallium phosphide (InGaP), gallium nitride (GaN), aluminumgallium arsenide (AlGaAs), indium phosphide (InP), indium galliumarsenide (InGaAs), indium gallium aluminum phosphide (InGaAlP), indiumgallium arsenide phosphide (InGaAsP), indium gallium nitride (InGaN),and aluminum gallium nitride (AlGaN).
 5. The method as defined in claim1, wherein the monolithic epitaxially-grown substrate assembly comprisesat least one of gallium arsenide (GaAs) and indium phosphide (InP). 6.The method as defined in claim 1, wherein the monolithicepitaxially-grown substrate assembly comprises at least one of siliconcarbide (SiC) and silicon germanium (SiGe).
 7. A method of producing amonolithic integrated chip with built-in transient voltage suppression,the method comprising: providing a monolithic, epitaxially-grownsubstrate assembly, wherein the substrate assembly includes: asemi-insulating substrate; an N+ sub-collector layer; an N-typecollector layer; a P-type base layer; and an N-type emitter layer;removing selected portions of the N-type emitter layer to isolatetransistors, steering diodes, and breakdown diodes, where at least aremaining portion of the N-type emitter layer is used to fabricateemitters for transistors and cathodes for breakdown diodes; removingselected portions of the P-type base layer to isolate transistors,steering diodes, and breakdown diodes, where at least a remainingportion of the P-type base layer is used to fabricate bases fortransistors, anodes for steering diodes, and anodes for breakdowndiodes; removing selected portions of the N-type collector layer toisolate transistors, steering diodes, and breakdown diodes, where atleast a remaining portion of the N-type collector layer is used tofabricate collectors for transistors and cathodes for steering diodes;isolating regions into the N+ sub-collector layer such that transistors,steering diodes, and breakdown diodes are electrically isolated; formingan insulating layer on selected portions the substrate assembly; andforming electrical connections to the transistors, steering diodes, andbreakdown diodes.
 8. The method as defined in claim 7, wherein theremoving selected portions of the N-type emitter layer further comprisesremoving all of the N-type emitter layer above a portion of a base layerthat is used to form an anode of a steering diode.
 9. The method asdefined in claim 7, wherein the monolithic, epitaxially-grown substrateassembly comprises at least one of gallium arsenide (GaAs), indiumgallium phosphide (InGaP), gallium nitride (GaN), aluminum galliumarsenide (AlGaAs), indium phosphide (InP), indium gallium arsenide(InGaAs), indium gallium aluminum phosphide (InGaAlP), indium galliumarsenide phosphide (InGaAsP), indium gallium nitride (InGaN), andaluminum gallium nitride (AlGaN).
 10. The method as defined in claim 7,wherein the monolithic, epitaxially-grown substrate assembly comprisesat least one of gallium arsenide (GaAs) and indium phosphide (InP). 11.The method as defined in claim 7, wherein the monolithic,epitaxially-grown substrate assembly comprises at least one of siliconcarbide (SiC) and silicon germanium (SiGe).
 12. A method of producing amonolithic integrated chip with built-in transient voltage suppression,the method comprising: providing a monolithic, epitaxially-grownsubstrate assembly, wherein the substrate assembly includes: asemi-insulating substrate; a P+ sub-collector layer; a P-type collectorlayer; an N-type base layer; and a P-type emitter layer; removingselected portions of the P-type emitter layer to isolate transistors andsteering diodes, where at least a remaining portion of the P-typeemitter layer is used to fabricate emitters for transistors; removingselected portions of the N-type base layer to isolate transistors andsteering diodes, where at least a remaining portion of the N-type baselayer is used to fabricate bases for transistors and anodes for steeringdiodes; removing selected portions of the P-type collector layer toisolate transistors and steering diodes, where at least a remainingportion of the P-type collector layer is used to fabricate collectorsfor transistors and cathodes for steering diodes; isolating regions intothe P+ sub-collector layer to isolate transistors and steering diodes;forming an insulating layer on selected portions the substrate assembly;and forming electrical connections to the transistors and steeringdiodes.
 13. The method as defined in claim 12, wherein the monolithicepitaxially-grown substrate assembly comprises at least one of galliumarsenide (GaAs), indium gallium phosphide (InGaP), gallium nitride(GaN), aluminum gallium arsenide (AlGaAs), indium phosphide (InP),indium gallium arsenide (InGaAs), indium gallium aluminum phosphide(InGaAlP), indium gallium arsenide phosphide (InGaAsP), indium galliumnitride (InGaN), and aluminum gallium nitride (AlGaN).
 14. The method asdefined in claim 12, wherein the monolithic epitaxially-grown substrateassembly comprises at least one of gallium arsenide (GaAs) and indiumphosphide (InP).
 15. The method as defined in claim 12, wherein themonolithic epitaxially-grown substrate assembly comprises at least oneof silicon carbide (SiC) and silicon germanium (SiGe).
 16. A method ofproducing a monolithic integrated chip with built-in transient voltagesuppression, the method comprising: providing a monolithic,epitaxially-grown substrate, wherein the substrate assembly includes: asemi-insulating substrate; an N+ sub-collector layer; an N-typecollector layer; a P-type base layer; and an N-type emitter layer;forming a transistor by: removing a first portion of the N-type emitterlayer, a first portion of the P-type base layer, and a first portion ofthe N-type collector layer from around a second portion of the N-typeemitter layer, a second portion of the P-type base layer, and a secondportion of the N-type collector layer; and isolating a first portion ofthe N+ sub-collector layer by ion implantation, where the ion-implantedfirst portion of the N+ sub-collector layer isolates a second portion ofthe N+ sub-collector layer from at least a third portion of the N+sub-collector layer; forming a steering diode by: removing a thirdportion of the N-type emitter layer, where the removed third portion ofthe N-type emitter layer removes substantially all of a portion of theN-type emitter layer above a third portion and a fourth portion of theP-type base layer; removing the third portion of the P-type base layerand a third portion of the N-type collector layer from around the fourthportion of the P-type base layer and a fourth portion of the N-typecollector layer; and using the fourth portion of the P-type base layerand the fourth portion of the N-type collector layer as an anode and acathode, respectively, of the steering diode; and, coupling at least twosteering diodes on the substrate assembly to protect a transistor on thesubstrate assembly from an undesired voltage transient.
 17. The methodas defined in claim 16, further comprising forming a breakdown diodefrom a transistor by using a base of the transistor as an anode of thebreakdown diode and an emitter of the transistor as a cathode of thebreakdown diode.
 18. The method as defined in claim 16, furthercomprising forming an electrical connection between the breakdown diodeand at least one of the two steering diodes through a metallizationlayer.
 19. The method as defined in claim 16, where the monolithic,epitaxially-grown substrate assembly comprises at least one of galliumarsenide (GaAs), indium gallium phosphide (InGaP), gallium nitride(GaN), aluminum gallium arsenide (AlGaAs), indium phosphide (InP),indium gallium arsenide (InGaAs), indium gallium aluminum phosphide(InGaAlP), indium gallium arsenide phosphide (InGaAsP), indium galliumnitride (InGaN), and aluminum gallium nitride (AlGaN).
 20. The method asdefined in claim 16, where the monolithic, epitaxially-grown substrateassembly comprises at least one of gallium arsenide (GaAs) and indiumphosphide (InP).
 21. The method as defined in claim 16, where themonolithic, epitaxially-grown substrate assembly comprises at least oneof silicon carbide (SiC) and silicon germanium (SiGe).
 22. The method asdefined in claim 16, where the removing is an etching process.
 23. Amethod of using pre-grown layers in a monolithic substrate assembly madefrom a compound semiconductor to form a transient voltage protectioncircuit, the method comprising: fabricating collector regions fortransistors and cathode regions for steering diodes from an N-typecollector layer; fabricating base regions for transistors and anoderegions for steering diodes from a P-type base layer; fabricating anemitter region for a transistor and a cathode region for a breakdowndiode from an N-type emitter layer; coupling an anode of a firststeering diode to a data line that is coupled to a transistor; couplinga cathode of the first steering diode to a first reference to protectthe transistor from an undesired positive-going voltage transient;coupling a cathode of a second steering diode to the anode of the firststeering diode and to the data line; and coupling an anode of the secondsteering diode to a second reference to protect the transistor from anundesired negative-going voltage transient.
 24. The method as defined inclaim 23, wherein the compound semiconductor is selected from a GroupIII-V compound semiconductor.
 25. The method as defined in claim 23,wherein the compound semiconductor is selected from a Group IV compoundsemiconductor.
 26. The method as defined in claim 23, furthercomprising: fabricating a cathode for a breakdown diode from the N-typeemitter layer; fabricating an anode for the breakdown diode from theP-type base layer; and coupling the cathode of the breakdown diode tothe cathode of the first steering diode and coupling the anode of thebreakdown diode to the anode of the second steering diode.
 27. Themethod as defined in claim 23, wherein the first reference and thesecond reference are the same.
 28. The method as defined in claim 23,wherein the first reference is a power supply line and the secondreference is a ground.
 29. A method of protecting a device on amonolithic gallium arsenide (GaAs) chip coupled to a signal line fromundesired voltage transients, the method comprising: clamping the signalline to a first positive voltage when the monolithic gallium arsenide(GaAs) chip is in a powered-on state in response to an undesired voltagetransient with a positive-going spike, where the first positive voltageis a first multiple of a forward voltage drop of a monolithicallyintegrated gallium arsenide (GaAs) diode above a power supply voltagethat is supplied to the monolithic chip; clamping the signal line to asecond positive voltage when the monolithic chip is in a powered-offstate, where the second positive voltage is a sum of the first multipleof the forward voltage drop of the monolithically integrated galliumarsenide (GaAs) diode and a reverse breakdown voltage of a breakdowndiode that is integrated into the monolithic chip, where the secondpositive voltage is referenced to ground; and clamping the signal lineto a negative voltage that is a second multiple of a forward voltagedrop of a monolithically integrated gallium arsenide (GaAs) diode belowa ground potential in response to an undesired voltage transient with anegative-going spike.
 30. The method as defined in claim 29, where thefirst multiple and the second multiple are a same value.
 31. The methodas defined in claim 29, where the first multiple and the second multipleare both a value of
 1. 32. The method as defined in claim 29, furthercomprising clamping pluralities of signal lines through pluralities ofsteering diodes on the monolithic chip, where the pluralities ofsteering diodes are coupled to a same breakdown diode.